MECHANIC iBGA Max 6 in 1 Mid-level Automatic Positioning Tin Planting Platform for Iphone X XS MAX 11 pro max PCB BGA Reballing
Description :
MECHANIC iBGA Reballing Positioning Planting Platform For Iphone X XS MAX 11 pro max Repair, MECHANIC iBGA Max 6 in professional BGA Reballing Stencil Fixture for iPhone X/Xs/XsMax/11/11pro/11pro max, it is used for positioning and reballing iPhone PCB BGA parts, convenient and faster for reballing BGA without any damage, offer you best solution for iPhone BGA reballing and repairing.
MECHANIC iBGA Max 6 in 1 Mid-level Automatic Positioning Tin Planting Platform
Feature:
Support with IPX / XS / XS MAX motherboard, RF small board IP11 / 11 PRO / 11 PRO MAX positioning tin replanting application
1. Anti-leakage tin barrier design
2. High temperature does not allow drum,
3. Strong magnetic automatic positioning
4. Integrated, removable tin planting,
5. Positioning slot of double-sided motherboard
